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PI3A412E 100TS 1N306 C2472PX PM3HPXX WM8781 ADM1066 PM3HPXX
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  Datasheet File OCR Text:
 Plastic Packages for Integrated Circuits Dual-In-Line Plastic Packages (PDIP)
N E1 INDEX AREA 12 3 N/2
E28.6A-S
28 LEAD DUAL-IN-LINE PLASTIC PACKAGE INCHES SYMBOL A
D
MILLIMETERS MIN 4.5 0.50 0.40 1.05 0.20 37.7 12.9 MAX 5.0 0.60 1.35 0.35 38.2 13.3 2.54 BSC 15.24 BSC 3.0 28
o o
MIN 0.178 0.020 0.016 0.042 0.008 1.485 0.508
MAX 0.196 0.023 0.053 0.13 1.503 0.523
NOTES 2 2 3 3 4 2 5
A1 B
A L A1 C L
BASE PLANE SEATING PLANE
B1 C D E1 e eA
eA
B1 B
e
C
0.100 BSC 0.600 BSC 0.119 28 0
o
NOTES: 1. Controlling Dimensions: MILLIMETER. In case of conflict between English and Metric dimensions, the metric dimensions control. 2. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 3. D and E1 dimensions do not include mold flash or protrusions. 4. eA is measured with the leads constrained to be perpendicular to base plane. 5. N is the maximum number of terminal positions.
L N
-
o
15
0
15
Rev. 1 4/95
13


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